Mechanical Engineer (Electronic Products) / 机械/结构工程师（电子产品方向）

外壳与结构设计

• 负责电子产品外壳的机械架构及 3D/2D 结构设计，平衡美学、人体工程学和成本。
• 与硬件工程师紧密合作，定义 PCB 外形轮廓（Outline）、元器件高度、接口/连接器布局及禁布区（Keep-out zones），确保无缝装配。
• 根据产品需求，选择合适的材料（如塑料、金属、硅胶）和制造工艺（如注塑成型、CNC 加工、钣金、3D 打印）。
• 进行公差尺寸链分析（Tolerance stack-up analysis）和结构干涉检查，确保所有机械部件的可靠性、配合度及表面精细度。

原型制作与可制造性设计（DFM）

• 制作并评估物理原型机（利用 3D 打印或 CNC）；针对面向制造的设计（DFM）和面向装配的设计（DFA）进行设计优化。

模具与工装跟进

• 与模具供应商共同评审模具图纸，跟进试模流程（T1、T2...），并解决结构缺陷（如缩水、熔接线、变形等）。

测试与验证

• 参与机械可靠性测试（如跌落测试、振动测试、冷热循环、防水/防尘测试等），并对任何失效模式进行根本原因分析（RCA）。

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Enclosure Design

• Responsible for the mechanical architecture and 3D/2D structural design of electronic product enclosures, balancing aesthetics, ergonomics, and cost.
• Work closely with the Hardware Engineer to define PCB outlines, component heights, connector placements, and keep-out zones to ensure seamless assembly.
• Select appropriate materials (e.g., plastics, metals, silicone) and manufacturing processes (e.g., injection molding, CNC machining, sheet metal, 3D printing) based on product requirements.
• Conduct tolerance stack-up analysis and structural interference checks to ensure the reliability, fit, and finish of all mechanical parts.

Prototyping & DFM

• Build and evaluate physical prototypes (using 3D printing or CNC); optimize designs for Design for Manufacturing (DFM) and Design for Assembly (DFA).

Mold & Tooling Follow-up

• Review mold drawings with tooling suppliers, follow up on mold trials (T1, T2...), and resolve mechanical defects (such as shrinkage, weld lines, or deformation).

Testing & Verification

• Participate in mechanical reliability testing (e.g., drop tests, vibration, thermal cycles, waterproof/dustproof testing) and drive root-cause analysis for any failures.

教育背景

• 机械工程、机电一体化、模具设计、产品设计或相关专业本科及以上学历。

工作经验

• 3-5 年电子产品（消费电子、工业模块或手持设备）结构设计经验。

硬实力/技术技能

• 熟练掌握至少一种主流 3D 建模软件（优先考虑 Creo/ProE、SolidWorks 或 UG/NX），并熟练使用 AutoCAD 绘制 2D 工程图。
• 深入理解塑料注塑成型原理、模具结构、钣金制造以及表面处理工艺（如喷涂、阳极氧化、丝网印刷）。
• 熟悉散热设计方法（散热片、导热垫）以及利用硅胶圈（Gasket）或超声波焊接进行的侵入防护（IP54/IP67 防水防尘）设计。

优先条件

• 拥有完整的产品生命周期管理经验，涵盖从最初的概念草图到量产交付（NPI 新产品导入流程）。
• 具备有限元分析（FEA）的基础知识，可进行结构强度或热仿真模拟。

软实力

• 对尺寸、公差和外观细节极度严谨。
• 具备卓越的沟通能力，能够完美衔接工业设计（ID）的美学要求、硬件（MD）的结构限制以及工厂的制造极限。

语言能力

• 具备良好的中文（普通话）口语及书面表达能力。
• 具备良好的英语口语及书面表达能力。

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Education

• Bachelor’s degree or above in Mechanical Engineering, Mechatronics, Mold Design, Product Design, or related fields.

Experience

• 3-5 years of experience in structural design for electronic products (consumer electronics, industrial modules, or handheld devices).

Technical Hard Skills

• Proficient in at least one mainstream 3D modeling software (e.g., preferred Creo/ProE, SolidWorks, or UG/NX) and AutoCAD for 2D engineering drawings.
• Deep understanding of plastic injection molding principles, mold structures, sheet metal fabrication, and surface treatment processes (e.g., painting, anodizing, silk-screening).
• Familiar with thermal dissipation methods (heatsinks, thermal pads) and ingress protection (IP54/IP67 waterproofing) design using gaskets or ultrasonic welding.

Preferred Qualifications

• Experience handling complete product lifecycles from initial concept sketch to mass production (NPI process).

• Basic knowledge of Finite Element Analysis (FEA) for structural strength or thermal simulations.

Soft Skills

• Highly meticulous regarding dimensions, tolerances, and cosmetic details.
• Excellent communication skills to bridge the gap between industrial design (ID) aesthetics, hardware (MD) constraints, and factory manufacturing limitations.

Language Skills

• Mandarin in spoken and written
• English in spoken and written