Senior Photonic Integration Engineer

Your mission

The future of AI computing is light, not electrons.
At Q.ANT, we are building photonic processing systems that compute with light—delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and high-performance computing.
As Senior Photonic Integration Engineer, you will drive the full-cycle co-integration of active components—specifically photodiodes, photodetectors, and lasers—into Q.ANT’s Photonic Integrated Circuits (PICs). Spanning the entire workflow from concept to characterized and validated assemblies, you will leverage deep opto-electronic expertise and microfabrication knowledge (photolithography, etch, deposition) to shape integration requirements and directly influence the fabrication flow. You will bridge PIC design, fabrication, electronics, and packaging to deliver reliable hardware that powers our roadmap.


Your Impact & Responsibilities

• Lead cross-functional projects focused on the hybrid integration of photodiodes, lasers, and active components on PIC platforms (LNOI,InP,SiPh)
• Define, plan, and execute full-cycle integration workflows—from initial design through fabrication, build, characterization, and system bring-up
• Bridge the gap between PIC fabrication flows and active component integration, establishing reproducible, high-yield co-integration processes
• Perform system-level testing and optical alignment, interfacing with electronic teams for signal readout (TIA/driver) and performance evaluation
• Manage cross-functional team efforts,establishing project schedules, risk mitigations, configuration control, and action logs
• Coordinate external suppliers, research partners, and service providers to ensure timely execution against project milestones
• Balance complex optical and electrical trade-offs (responsivity vs. bandwidth vs. noise) tob optimize assembly yield, SNR, and throughput

Your profile

Why us?

• Work on the leading edge: Shape the future of photonic computing by co-integrating active components with next-generation PIC platforms.
• Make impact at scale: Directly optimize assembly yield, bandwidth, and SNR, driving technology from early prototypes into scalable, high-performance computing systems.
• Broad autonomy: Enjoy wide freedom to design novel integration flows, select materials/attachment methods, introduce automation strategies, and propose new process trials.
• Fast-track your growth: Work on multi-disciplinary challenges that combine microfabrication, optics, and high-speed electronics—building new institutional knowledge and industry-defining IP.
• World-class team: Collaborate with an international team of cross-functional experts in photonics, semiconductor processing, electronics, and packaging.
• Direct access to leadership: Work closely with engineering leads, company founders, and an advisory board that has shaped the semiconductor industry.