Sr.Staff / Staff Board Package Design Engineer

We are looking for an experienced leader for high performance SOCs/MCUs, for board and packaging group.

Essential Functions:

• Highly experienced in board and package design from block level to final board and package delivery.
• Should have the ability to work independently with little supervision and drive the team to define, develop and execute the product plan from specification to release.
• Must be a natural team player and strive towards fostering a highly creative and productive working environment

Minimum Requirements:

• MTech/BTech in EC/ EE/CS with hardware engineering experience of 7 to 15 years.
• Experience in Microcontroller and Microprocessor based complex design
• Experience in latest packaging Technologies and Manufacturing process
• Strong domain knowledge of system clocking, system modes, power management, debug

Additional Preferred Qualifications:

• Board level System architecture and design includes memory or communication interfaces.
• SOC specifications and board level system specifications.
• Development and design of SOC power supply, system power supply specifications, and PMIC specifications.
• Interface specifications incorporating SOC-peripheral devices
• Experience with high-speed interface i.e. PCIe Gen3/4/5/, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory
• Board level DC/AC simulations.
• Schematic, Layout and BOM generation using modern CAD tools
• Experience with SoC Bring-up activities
• Familiarity with PCB technologies, DFM, DFA, materials, stackup design, assembly rules and manufacturing process
• Experience with tools: Ansys HFSS or Cadence SI/PI, or other SI/PI, Cadence APD (Allegro Package Designer) for IC package layout design, SIwave, HSPICE, ADS, Q3D
• Experience in IC packaging layout design, emphasizing advanced technologies like SiP (System-in-Package), flip-chip, and 3D packaging.
• Comprehensive knowledge of packaging design aspects, encompassing power distribution, thermal control, and signal fidelity. Thermal simulation experience is added advantage.
• Profound understanding of semiconductor manufacturing methodologies and packaging assembly processes
• Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.

With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’

At Renesas, you can:

• Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.

• Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure.

• Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?

Join Renesas. Let’s Shape the Future together.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .